Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface

Abstract

Microstructure changes at the interface between Sn-Cu solders and Cu substrate cause by minor additions of Ni as well as the physical properties of intermetallic compound formed at this interface were investigated using light and scanning electron microscopy.

Keywords

• Microstructure
• Changes
• and
• Physical
• Properties
• the
• Intermetallic
• Compounds
• Formed
• the
• Interface