Abstract
The study demonstrates the possibility of using Tm:YAP laser radiation for the removing ceramic brackets. The amount of enamel loss and residual resin on teeth has been evaluated.
A diode-pumped Tm:YAP microchip laser generating at wavelength 1.9 mu m was used for the debonding process. The transmission and absorption measurement of the basic elements - bracket, adhesive resin, and enamel was analyzed to explain the source of the heat and bracket debonding.
Quantitative measurements are made for visualizing enamel surface before and after a self-ligating bonding technique. Temperature rise observation during the debonding procedure - from 0.5 to 2 W power - has improved the accuracy of assessment.
The results were evaluated by CCD camera and scanning electron microscope. From the measurements it is possible to conclude that continuously running small diode pumped Tm:YAP microchip laser having output power 1W can remove the ceramic bracket without enamel iatrogenic damage.