Abstrakt
One of the most favour components, which are mounted on the printed circuit board (PCB), is Ball Grid Array (BGA) due to higher integration. On the other hand BGAs are components which are the most problematic from point of solder interconnection reliability.
The aim of this work was to make experimental study of the influence of the temperature profile on the BGA soldering during its reworks on electronic equipments from point of observing the distance between the PCB and BGA package. Five temperature profiles were used with following maximum temperature in peak 239 degrees C, 246 degrees C, 253 degrees C, 255 degrees C and 259 degrees C.
X-ray diagnostic of the distances between the BGA package and PCB were used with the inspection angle 45 degrees. Three BGAs were soldered and inspected for each temperature profile.
The issues were found only in case when was used the temperature profile with highest maximum temperature.