Effect of Ni on the structure and properties of the intermetallic layer formed by the reaction of liquid SnCu0,7 solder with Cu substrate

Abstract

Effect of Ni on the structure and properties of the intermetallic layer formed by the reaction of liquid SnCu0,7 solder with Cu substrate

Keywords

• Effect
• structure
• properties
• intermetallic
• layer
• formed
• reaction
• liquid
• SnCu0
• solder
• substrate