- Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface2010 | Faculty of Mathematics and Physics
- The Effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate2009 | Faculty of Mathematics and Physics
- Intermetallic compounds at the interface between SnCu(Ni) solders and Cu substrate2009 | Faculty of Mathematics and Physics